• SiC Ingot Cutting Machine For  4 Inch 6 Inch 8 Inch 10 Inch SiC Cutting Speed 0.3 Mm/Min Average
  • SiC Ingot Cutting Machine For  4 Inch 6 Inch 8 Inch 10 Inch SiC Cutting Speed 0.3 Mm/Min Average
  • SiC Ingot Cutting Machine For  4 Inch 6 Inch 8 Inch 10 Inch SiC Cutting Speed 0.3 Mm/Min Average
  • SiC Ingot Cutting Machine For  4 Inch 6 Inch 8 Inch 10 Inch SiC Cutting Speed 0.3 Mm/Min Average
SiC Ingot Cutting Machine For  4 Inch 6 Inch 8 Inch 10 Inch SiC Cutting Speed 0.3 Mm/Min Average

SiC Ingot Cutting Machine For 4 Inch 6 Inch 8 Inch 10 Inch SiC Cutting Speed 0.3 Mm/Min Average

Product Details:

Place of Origin: China
Brand Name: ZMSH
Model Number: SiC Ingot Cutting Machine

Payment & Shipping Terms:

Payment Terms: T/T
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Detail Information

Crystal Size Range: 4, 6, 8, And 10-inch SiC Average Cutting Speed: 0.3 Mm/min
Max. Cutting Force: 0–110N (0.25mm Wire With 45N Tensile Force) Tensile Strength Of Wire: ≥0.18mm
Surface Finish: Ra ≤ 0.3μm Machine Size (L × W × H): 2500 × 2300 × 2500 Mm
Highlight:

10 inch SiC Ingot Cutting Machine

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SiC Ingot Cutting Machine

Product Description

SiC Ingot Cutting Machine for 4, 6, 8, and 10-inch SiC Cutting Speed: 0.3 mm/min (average)

 

SiC Wire Saw Cutting Machine Abstract

The SiC Wire Saw Cutting Machine by ZMSH is designed for precision cutting of silicon carbide (SiC) materials. It efficiently handles various crystal sizes, offering high cutting speeds and accuracy. This machine is ideal for SiC boule cutting, suitable for 6-inch, 8-inch, and 10-inch SiC crystals. The advanced wire saw technology ensures smooth, high-quality surface finishes and minimizes material wastage. This machine is a key asset for semiconductor manufacturers, particularly in the production of SiC wafers for power devices and other high-tech applications.

 

 

SiC Ingot Cutting Machine For  4 Inch 6 Inch 8 Inch 10 Inch SiC Cutting Speed 0.3 Mm/Min Average 0SiC Ingot Cutting Machine For  4 Inch 6 Inch 8 Inch 10 Inch SiC Cutting Speed 0.3 Mm/Min Average 1


SiC Wire Saw Cutting Machine Properties

  • Crystal Size Range: 4, 6, 8, and 10-inch SiC
  • Cutting Speed: 0.3 mm/min (average)
  • Cutting Steps: ≤30°
  • Max. Cutting Force: 0–110N (0.25mm wire with 45N tensile force)
  • Tensile Strength of Wire: ≥0.18mm
  • Surface Finish: Ra ≤ 0.3μm
  • Machine Size: 2500 × 2300 × 2500 mm (L × W × H)
  • Machine Power: 50 kW
  • Cutting Error Rate: ≤1% (excluding material and maintenance-related factors)
  • Equipment Weight: ≤5.5t
  • Noise Level: ≤80 dB

 

SiC Wire Saw Cutting Machine Chart: Technical Specifications

Parameter Value
Crystal Size Range 4, 6, 8, and 10-inch SiC
Average Cutting Speed 0.3 mm/min
Max. Cutting Force 0–110N (0.25mm wire with 45N tensile force)
Tensile Strength of Wire ≥0.18mm
Surface Finish Ra ≤ 0.3μm
Machine Size (L × W × H) 2500 × 2300 × 2500 mm
Machine Power 50 kW
Cutting Error Rate ≤1% (excluding external factors)
Equipment Weight ≤5.5t
Noise Level ≤80 dB

 

 


 

 

SiC Wire Saw Cutting Machine ZMSH Services

At ZMSH, we offer a comprehensive range of services to ensure the seamless operation and performance of our SiC Wire Saw Cutting Machines.

  • Customization: Tailored solutions to meet specific production requirements, including custom crystal sizes and cutting parameters.
  • On-Site Installation: Expert installation and setup by our qualified engineers, ensuring the machine operates at peak efficiency.
  • Training: Comprehensive training for your staff on machine operation, maintenance, and troubleshooting.
  • After-Sales Support: Full after-sales service including maintenance, repairs, and technical support to ensure continuous operation.
  • Upgrades: We offer software and hardware upgrades as technology evolves, ensuring your machine remains competitive in the industry.

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