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Micro-jet laser machine for Metal matrix composite processing wafer cutting dicing slicing
Product Details:
| Place of Origin: | China |
| Brand Name: | ZMSH |
Payment & Shipping Terms:
| Minimum Order Quantity: | 1 |
|---|---|
| Delivery Time: | 6-8 month |
| Payment Terms: | T/T |
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Detail Information |
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| Countertop Volume: | 300*300*150 | Linear Axis XY: | Linear Motor. Linear Motor |
|---|---|---|---|
| Linear Axis Z: | 150 | Positioning Accuracy μm: | +/-5 |
| Repeated Positioning Accuracy μm: | +/-2 | Numerical Control: | 3 Axis /3+1 Axis /3+2 Axis |
| Numerical Control Type: | DPSS Nd:YAG | Wavelength Nm: | 532/1064 |
| Rated Power W: | 50/100/200 | Water Jet: | 40-100 |
Product Description
Micro-jet laser machine for Metal matrix composite processing wafer cutting dicing slicing
Micro-jet Laser Equipment & Linear Motor for Wafer Dicing and Slicing Product Overview:
The Micro-jet Laser Machine is a cutting-edge solution designed for high-precision processing of Metal Matrix Composites (MMCs), along with wafer cutting, dicing, and slicing. Utilizing advanced laser microjet (LMJ) technology, this machine provides a unique combination of laser energy and high-speed water jet for efficient and clean material removal, significantly reducing thermal damage and mechanical stress on sensitive materials. Ideal for industries such as semiconductor manufacturing, aerospace, and advanced materials processing, the system excels in handling hard and brittle materials like Silicon Carbide (SiC), Gallium Nitride (GaN), and other specialized composites. Its automated, low-waste operation ensures superior surface finishes, high-quality cuts, and reliable, consistent results, contributing to increased yield rates and reduced operational costs. This technology addresses traditional processing limitations, offering a sustainable and scalable solution for the most demanding applications in high-performance industries.
Machine Specifications:
| Specification | Model 1 | Model 2 |
|---|---|---|
| Countertop Volume | 300 x 300 x 150 mm | 400 x 400 x 200 mm |
| Linear Motor (XY Axis) | Linear motor | Linear motor |
| Linear Motor (Z Axis) | 150 mm | 200 mm |
| Positioning Accuracy | ±5 μm | ±5 μm |
| Repeated Positioning Accuracy | ±2 μm | ±2 μm |
| Acceleration | 1 G | 0.29 G |
| Numerical Control (CNC) | 3 - axis / 3+1 axis / 3+2 axis | 3 - axis / 3+1 axis / 3+2 axis |
| Laser Type | DPSS Nd:YAG | DPSS Nd:YAG |
| Wavelength | 532 nm / 1064 nm | 532 nm / 1064 nm |
| Rated Power | 50 W / 100 W / 200 W | 50 W / 100 W / 200 W |
| Water Jet | 40 - 100 | 40 - 100 |
| Nozzle Pressure | 50 - 100 bar | 50 - 600 bar |
| Dimensions (Machine) | 1445 x 1944 x 2260 mm | 1700 x 1500 x 2120 mm |
| Dimensions (Control Cabinet) | 700 x 2500 x 1600 mm | 700 x 2500 x 1600 mm |
| Weight (Machine) | 2.5 tons | 3 tons |
| Weight (Control Cabinet) | 800 kg | 800 kg |
Processing Capabilities:
| Capability | Model 1 | Model 2 |
|---|---|---|
| Surface Roughness | Ra ≤ 1.6 μm | Ra ≤ 1.2 μm |
| Opening Speed | ≥ 1.25 mm/s | ≥ 1.25 mm/s |
| Circumference Cutting Speed | ≥ 6 mm/s | ≥ 6 mm/s |
| Linear Cutting Speed | ≥ 50 mm/s | ≥ 50 mm/s |
Materials Processed:
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Gallium Nitride (GaN) Crystal
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Ultra-Wide Band Gap Semiconductors (Diamond / Gallium Oxide)
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Aerospace Special Materials
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LTCC Carbon Ceramic Substrates
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Photovoltaics
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Scintillator Crystals
Our Advantages
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Cutting-Edge Micro-jet Laser Technology
We are at the forefront of utilizing Laser Microjet (LMJ) technology, which combines laser energy with high-speed water jets to achieve precise and efficient material removal. This innovative approach results in minimal thermal damage and ensures superior quality cuts for hard and brittle materials like Silicon Carbide (SiC), Gallium Nitride (GaN), and other advanced semiconductors. -
High Efficiency and Precision
Our micro-jet laser equipment offers remarkable processing efficiency, significantly enhancing throughput while maintaining high precision. This capability is especially crucial in industries such as semiconductor manufacturing and aerospace, where precision is essential for maintaining the structural integrity of materials.
Q&A for Micro-jet Laser Machine
Q1: What is the Micro-jet Laser Machine and how does it work?
A1:
The Micro-jet Laser Machine combines advanced Laser Microjet (LMJ) technology, which integrates a focused laser beam with a high-speed water jet. This combination allows for precise, efficient, and clean material removal. The water jet stabilizes the laser, reducing thermal damage and mechanical stress while ensuring high-precision cuts in hard and brittle materials.
Q2: What materials can the Micro-jet Laser Machine process?
A2:
The Micro-jet Laser Machine is highly versatile and can process a wide range of materials, including:
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Silicon Carbide (SiC)
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Gallium Nitride (GaN)
-
Ultra-Wide Bandgap Semiconductors (Diamond, Gallium Oxide)
-
Aerospace Special Materials
-
LTCC Carbon Ceramic Substrates
-
Photovoltaic Components
-
Scintillator Crystals
It is suitable for industries such as semiconductor manufacturing, aerospace, and advanced materials processing.
