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Glass laser drilling machine sapphire processing wavelength 532nm High Precision
Product Details:
| Place of Origin: | China |
| Brand Name: | ZMSH |
Payment & Shipping Terms:
| Minimum Order Quantity: | 1 |
|---|---|
| Delivery Time: | 6-8months |
| Payment Terms: | T/T |
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Detail Information |
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| Wavelength: | 532nm | Laser Power: | 15W/30W |
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| Accuracy: | ≤±0.015mm | Polishing: | ≤±0.1mm |
| Processing Area: | 900mm × 600mm | Max Glass Size: | 300mm × 300mm |
Product Description
Laser Drilling System: Precision Engineering for Glass Processing
The laser drilling systems are innovative solutions designed to revolutionize glass processing across industries. Engineered with a customized 532nm green laser, these systems deliver unparalleled precision, minimal thermal damage, and exceptional stability. Ideal for display glass, quartz, and semiconductor wafers, we ensures non-contact processing with crack rates as low as 0.1%, making it the gold standard for high-precision applications.
Key Features:
- Custom Green Laser Technology: Optimized for glass drilling with minimal heat-affected zones (HAZ).
- Dual Power Options: 15W/30W adjustable laser power for versatility in material thickness.
- User-Friendly Operation: Intuitive interface with a color touchscreen and programmable controls.
- High Material Utilization: Flexible cutting paths maximize yield and reduce waste.
Technical Specifications & Differentiators
|
Component |
Parameter |
| Wavelength | 532nm (Green Laser) |
| Max Laser Power | 15W/30W |
| Max Glass Size | 300mm × 300mm |
| Processing Area | 900mm × 600mm |
| Accuracy | ≤±0.015mm |
Performance & Quality
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Unmatched Precision:
- Achieves ±0.015mm accuracy, ideal for micro-hole arrays in MEMS sensors and smartphone cameras.
- Edge roughness (Ra) ≤0.5μm ensures smooth, burr-free finishes.
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Stability & Efficiency:
- 8-hour continuous operation with 99.8% yield, supported by dual cooling systems (air + water).
- Automated focus adjustment eliminates manual intervention.
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Minimal Thermal Damage:
- Green laser wavelength reduces heat diffusion, preventing micro-cracks and material deformation.
Applications
ZMSH Glass Laser Drilling Machine
Frequently Asked Questions (FAQ)
Q: What material compatibility is supported beyond glass?
A: Besides standard soda-lime glass, the system processes quartz, borosilicate glass, and semiconductor-grade silicon wafers (with thermal conductivity ≤150 W/m·K). The green laser’s 532nm wavelength ensures absorption efficiency across these materials without requiring coating or pretreatment.
Q: How is dimensional accuracy maintained for large-format glass (900×600mm)?
A: Equipped with a linear motor-driven Z-axis and real-time collimation feedback, the system compensates for thermal drift and mechanical vibration. A patented dynamic focal length adjustment maintains ±0.015mm accuracy even at the edges of large plates.
Q: What environmental controls are required for optimal performance?
A: The device operates in ambient temperatures of 20±5°C with relative humidity ≤60%. For extreme environments, optional temperature-stabilized enclosures (+/-0.5°C) and dustproofing kits are available to prevent laser beam distortion.
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